42233
Accession Number
38351
Title Of Article Chaper
Microstructure and Materials Analysis for Electronics Packaging
Title Of Journal Book
Struture: Struers Journal of Materialography
Issue
32
Pages
44459
Collation
12 p. : ills.
Reference Bibliography
Includes bibliographic references
Language Of Text
English
Literature Type
Serial
Literature Level
Analytic
Keywords
microstructure;material;analysis;electronic;packaging;metallography;preparation;optical;light;technique;imaging;sem;technique;edx;tem
pub_id
42233