34056
Accession Number
4245
Title Of Article Chaper
On the Growth of An Alloy Layer Between Solid Copper and Liquid Tin
Title Of Journal Book
Nippon Kinzoku Gakkaishi (J. Jap. Inst. Met.) 34
Pages
539-546
Literature Level
Analytic
Abstract
The purpose of this study was to make clear the growth process of an alloy layer formed between solid copper and liquid tin which has influence upon the mechanical properties of soldered joints.
Keywords
copper;tin;solid;liquid;soldering;metals;metallurgy
pub_id
34056