The present uses of hot-melt adhesives are reviewed, and future trends are predicted to be improvements in materials such as graft copolymers with hight temperature resistance, 100% solids acrylic copolymers, more stable block copolymers, alkali-dispersible polymers, and new high performance resins. The application of UV and electron beam curing techniques to hot-melts is discussed. It is anticipated that by 1985 hot-melts will account for 30-40% of the pressure-sensitive adhesive market, the overall growth rate for hot-melts being 15-25%. -- AATA