The miniaturization of electronic devices has been made possible by the development of integrated circuits, which have reduced the need for individual electronic components as building blocks of electronic circuits. Metallography plays a vital role in the design, development and failure analysis of chip-based components. The metallographic preparation of cross sections of these microelectronics is very time-consuming, and requires patience and skill to grind and polish to a specific target inside the component. In addition, the different materials used in devices and components, such as metal, glass and ceramics, have different characteristics and make the preparation difficult. Special tools can help to improve the manual and semi-automatic preparation of microelectronics. For automatic target preparation the Struers TargetSystem offers a fast and very precise grinding and polishing to the target quickly. To avoid relief between hard and soft layers and materials, diamond grinding on rigid discs and diamond polishing on hard cloths is recommended.