28529
Accession Number
18504
Title Of Article Chaper
Through-the-thickness braiding technology
Title Of Journal Book
Advancing technology in materials and processes: 30th national SAMPE symposium and exhibition, Disneyland Hotel, Anaheim, California, March 19-21, 1985
Volume
30
Pages
1509-1518
Collation
10 refs.
Publisher
Society for the Advancement of Material and Process Engineering
Publisher City
Covina
Language Of Text
English
Literature Type
Monograph
Literature Level
Analytic
Meeting
National SAMPE symposium and exhibition (30)
Meeting City
Anaheim
Abstract
The author describes and contrasts through-the-thickness, or three-dimensional, braiding with conventional braiding and weaving operations. Mechanisms and damage tolerance characteristics. -- AATA
pub_id
28529
Meeting Date
19850319-19850321