9699
Accession Number
15489
Title Of Article Chaper
Application of thermal analysis for the investigation of epoxy resins
Title Of Journal Book
Progress in organic coatings
Volume
12
Issue
1
Pages
27-116
Collation
42 figs.
Literature Type
Serial
Literature Level
Analytic
Abstract
Possible applications of thermal analysis are presented. Differential thermal analysis (DTA) and differential scanning calorimetry (DSC) are used to study the kinetics of the polymerization reaction of 18 epoxies and 22 curing agents. Cured epoxies are identified by means of thermogravimetry (TG). Thermodilatometry (TDA) and thermomechanical analysis (TMA) are used in the evaluation of adhesion properties. -- AATA
Keywords
DTA, DSC, TG, TDA, TMA;Epoxy resin analysis;Synthetic resin epoxy; Synthetic resin analysis AATA
pub_id
9699