4521
Accession Number
3328
Title Of Article Chaper
Mutual Diffusion of Titanium w. Copper & Other Metals as Applicable to the Soldered Compounds
Title Of Journal Book
Akad. Nauk, SSSR, inst. Met Baikova
Pages
289-293
Literature Level
Analytic
Abstract
The strength of soldered compounds of titanium products is determined by the phase structure of the diffusion layer formed in the process of soldering between titanium and a protective galvanic coating. It was shown that in the diffusion zone, nuclei of the second phase may be formed which strengthen the soldered compound provided they are small and are not mutually overlapped. If the nuclei of the new phase are enlarged to such a size that they are overlapped among themselves the strength of the soldered compound is sharply reduced. So as to determine the service period of soldered compounds, functioning at higher temperatures, it was necessary to investigate the Kinetic process of Mutual diffusion between titanium and galvanic coatings at ordinary operation temperatures. With this aim in mind, experiments were also carried out on the mutual diffusion between titanium and other metals serving as galvanic coatings, the interval of temperatures from 200-900 degrees C. Silver, copper, nickel, alloys of Co-Ni (70% by weight Co), chromium, rhodium and rhenium were used as galvanic coatings.
Keywords
titanium;copper;soldering;metallurgy
pub_id
4521